Heyaru

Thermal Management:

Highest room temperature thermal conductivity of any material

The thermal management properties of CVD diamonds deal with today’s single largest failure causes in electronics- heat:

1. Heat spreaders with 4 levels of thermal conductivity available- 1000-2000 W/mk

2. GaN on diamond wafer substrates are offered with 3x improvement in heat dissipation whilst preserving RF performance

3. It outperforms silicon carbide, copper and aluminum by factors of 3-10

 

 

Heyaru’s proficiency guarantees the ease of customer implementation:

Heyaru facilitates the customers to integrate its free standing diamond heat spreaders into their systems and modules

1. Low roughness and very flat models ensuring the ease of attachment and minimized thermal interface resistances

2. Upto 3mm thickness is available

3. Metallization solutions enable die bonding with low thermal barrier resistance, consistent with the industry standard brazing and soldering

4. Free standing diamond available in large areas upto 140mm diameter that can be laser cut to preferred size

5. Extended device lifetimes for a specific power level with increased efficiency and performance:

6. Heyaru’s CVD diamond heat spreaders and GaN on diamond wafers